9 Windows is a creative thinking tool that is excellent for the generation of new ideas. It makes us think inventively, taking into consideration space and time. 9 Windows helps to predict the future based on analysis of past to present development occurring within a certain system. However, the future is exactly what we need; any new idea should be about a future; otherwise, this is not a new idea but not what we need.
9 Windows encourages a logical, systematic examination of correlations across time and space. This approach compels us to understand the structure of a system in both historical and current contexts, thereby suggesting future pathways for development and innovation. It excels at visually representing problems within their spatial and temporal dimensions.
Consider these scenarios where you and your team can harness the advantages of 9 Windows:
9 Windows is a versatile managerial creative thinking tool for system analysis and forecasting future development directions. It excels in problem-solving and fostering innovation, making it suitable for addressing both unexpected parameter deviations (excursions) and persistent issues.
Here are some scenarios where 9 Windows proves to be a valuable asset:
While these examples highlight its utility, the 9 Windows thinking process can be flexibly applied in various other contexts, cementing its position as an essential tool for innovative problem-solving.
To address the requirement for smaller and more powerful processors, innovative 3D packaging is developed, which involves stacking many layers vertically. This enhances performance but produces mechanical difficulties such as wafer bowing as a result of internal tension caused by thermal expansion mismatch. this problem has approached from a materials engineering perspective, investigating how material selection, layer thickness, and deposition conditions may minimize stress and prevent deformation.
The process is related to microelectronics - microchip manufacturing.The purpose of the process is to create a SiO2 layer on the surface of a Si wafer. Equipment: Vertical furnace to heat the wafers in the Q2 atmosphere and perform oxidation on the wafer surface. Process: The oxidation occurs on the front side and on the back side of the wafer Requirements: Create a SiO2 thin layer with a certain thickness and low sigma - low standard deviation of the thickness between the wafers and within the waferFailure: Wafers from the lower zone have higher thickness and significantly higher within wafer sigma (standard deviation of the thickness within the wafer)
Wet cleaning is widely used in microchip manufacturing. Single wafer equipment is working as follows. A wafer rotates, and chemistry is poured from a movable nozzle. Water rinsing is performed at the end of the process. Loading of a new batch of the chemistry resulted in excursion - a strongly increased amount of defects was observed on the wafer after the processing. The project is dedicated to the failure analysis and creation of innovative solutions.
In response to the potential outbreak of a third world war and the risk of Egypt becoming isolated from global trade and financial systems, this project aims to develop a self-sustaining, decentralized digital ecosystem. The goal is to ensure economic stability, resource accessibility, and secure communication for citizens, businesses, and the government in times of crisis.This solution will be delivered as an application-based platform that integrates barter trade, digital currency, AI-driven supply chain management, emergency communication, and cybersecurity measures. By leveraging blockchain technology, AI-powered logistics, and decentralized networking, the platform will enable uninterrupted trade, resource distribution, and crisis coordination without reliance on external financial institutions or internet-based infrastructure.
The integration of CFRP materials into automotive designs presents challenges related to compatibility, performance, and safety, necessitating a careful transition from a Chromolly tubular space frame to a CFRP monocoque. Key considerations include determining the optimal geometry for suspension, aerodynamic features, and the placement of components like the battery pack and sensors, all while adhering to FSAE safety protocols. Additionally, decisions regarding the production method—whether to use preimpregnated carbon fibers or an injection method—must be made early to facilitate timely production. The development process involves creating molds and plugs from suitable materials, ensuring that all assemblies can be connected without compromising structural integrity, and maintaining strict adherence to budget constraints and sourcing of materials.
This project showcases how functional modeling can drive innovation by analyzing and simulating various versions of a vacuum cleaner. By studying the functional model, you will experience firsthand how the Functional Modeling creative thinking tool helps identify opportunities for improvement and generate innovative ideas for the next generation of products.Through this example, you’ll learn how to dissect the functionality of a vacuum cleaner, revealing ways to enhance its performance, efficiency, and user experience—ultimately paving the way for future innovations.
The project was dedicated to production yield improvement in microchip manufacturing. The bumps are created on the top of a wafer and used for the final test of all dies. Only good dies are taken for the packaging. All dies that fail the test will be scrapped. The process yield depends on the amount of "good" and "bad" dies. It was revealed that in some cases, the time between the end of the process and the final test impacts the yield. The longer the dwelling, the more dies fail the final test. If the dwelling exceeds hundreds of hours, the amount of failed dies becomes dramatically high, which results in the scrapping of the whole wafer. The problem was analyzed and solved.
Flash heating of a wafer is widely used in microchip manufacturing. The purpose of the process is to prevent the diffusion of ions and atoms. During the flash process, a wafer breakage occurs. The project's purpose is to learn and understand the mechanism of the wafer breakage and propose the solutions to prevent the wafer breakage
