Give your team the right tools so they can solve the toughest problems, keep improving, and elevate your company.
PRIZ gave our team a structured way to move from firefighting to real root-cause thinking. It helped us align faster and turn investigations into reusable learning.
PRIZ Guru gives you a guided, no-guesswork workflow for root cause analysis, process improvement, and systematic innovation, so you spend less time firefighting and more shipping reliable, profitable outcomes.
PRIZ helped us stop jumping to fixes and first understand what was really happening.
The value was not just solving one issue. It was finally seeing why the problem kept coming back.
The discussion shifted from opinions to mechanisms, actions, and measurable business impact.
PRIZ gave the team a disciplined way to connect symptoms, process conditions, and root-cause hypotheses.
It gave engineers a shared language. The meetings became clearer, faster, and less political.
PRIZ Guru is a methodology-first innovation platform that systematizes problem solving and helps teams generate the innovative solutions companies need to stay competitive and profitable. With a unified toolkit of structured methods and processes, PRIZ strengthens engineering thinking and promoting seamless communication among all stakeholders.
Our platform offers a range of creative thinking tools that help you think outside the box and develop new, innovative solutions.
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Guided facilitation walks teams through a structured, repeatable process that strengthens engineering thinking, drives continuous improvement, and embeds consistent learning across the organization. Works fully without AI; an optional assistant can speed feedback, research, and reporting.
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Our platform offers a seamless integration between project management and your problem-solving process.
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Our platform promotes open communication, shared goals, conflict resolution, collective ownership, trust, and positive relationships among all stakeholders.
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Engineers no longer have to do the most boring part of problem-solving - writing a report for stakeholders - as the report is automatically generated for them.
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The ultimate goal of every project is to generate innovative ideas and solutions. PRIZ Platform's idea management provides full transparency of all ideas and decisions made throughout a project.
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Wet cleaning is widely used in microchip manufacturing. Single wafer equipment is working as follows. A wafer rotates, and chemistry is poured from a movable nozzle. Water rinsing is performed at the end of the process. Loading of a new batch of the chemistry resulted in excursion - a strongly increased amount of defects was observed on the wafer after the processing. The project is dedicated to the failure analysis and creation of innovative solutions.
This project investigates how to increase the copper removal rate during Chemical Mechanical Planarization (CMP). Functional modeling revealed that increasing H₂O₂ alone is ineffective beyond an optimum level because rapid oxidation creates a thick, passivating Cu₂O/CuO layer that must be mechanically removed. The winning direction is to balance faster oxidation with stronger mechanical removal by optimizing pad speed, abrasive concentration, pressure, conditioning, and slurry transport.
Semiconductor devices are becoming more complex and expensive. But what exactly are we paying for when we buy a computer, cellphone, or any device containing a microchip? It’s not for radically new functions—the core components remain the same: transistors and interconnections. According to Moore’s law, transistors are getting smaller, with more interconnection layers added, making the manufacturing process longer and more costly. In reality, we’re paying for the inability of engineers to efficiently solve engineering challenges. This project leverages System Functional Modeling (SFM) to analyze the IC interconnection layer and Process Functional Modeling (PFM) to evaluate its manufacturing process. These analyses aim to deepen our understanding of both the device and the production process, generating innovative solutions for cost reduction and improved efficiency.
The process is related to microelectronics - microchip manufacturing. The purpose of the process is to create a SiO2 layer on the surface of a Si wafer. Equipment: Vertical furnace to heat the wafers in the Q2 atmosphere and perform oxidation on the wafer surface. Process: The oxidation occurs on the front side and on the back side of the wafer Requirements: Create a SiO2 thin layer with a certain thickness and low sigma - low standard deviation of the thickness between the wafers and within the wafer Failure: Wafers from the lower zone have higher thickness and significantly higher within wafer sigma (standard deviation of the thickness within the wafer)
We offer a variety of courses to help you learn how to use our app to solve problems. Our courses are designed for users of all skill levels, from beginners to experienced users. Our courses include video lessons, hands-on exercises, and support from experienced instructors.
