Solve engineering problems with PRIZ
PRIZ Guru provides a complete package for engineering organizations, offering a comprehensive and unique solution for systematic and systemic problem-solving.
TRUSTED BY TOP COMPANIES
PRIZ Guru provides a complete package for engineering organizations, offering a comprehensive and unique solution for systematic and systemic problem-solving.
TRUSTED BY TOP COMPANIES
PRIZ Guru provides a state-of-the-art machine-assisted innovation platform that streamlines problem-solving and helps to uncover hidden business opportunities. With a comprehensive ecosystem of tools and processes, PRIZ supports and enhances engineering thinking while promoting seamless communication among all stakeholders.
Our platform offers a range of creative thinking tools that help you think outside the box and develop new, innovative solutions.
Learn moreAI-Assisted Facilitation will guide you through a structured process to increase your efficiency in engineering thinking and continuous improvement, while promoting consistent learning within an organization.
Learn moreOur platform offers a seamless integration between project management and your problem-solving process.
Learn moreOur platform promotes open communication, shared goals, conflict resolution, collective ownership, trust, and positive relationships among all stakeholders.
Learn moreEngineers no longer have to do the most boring part of problem-solving - writing a report for stakeholders - as the report is automatically generated for them.
Learn moreThe ultimate goal of every project is to generate innovative ideas and solutions. PRIZ Platform's idea management provides full transparency of all ideas and decisions made throughout a project.
Learn moreOur experts will guide you through every step, helping you master the PRIZ ecosystem, its functionalities, and problem-solving techniques. With tailored training, you'll be well-prepared to tackle any challenge that comes your way.
Contact SalesOur training provides engineers with the necessary skills and knowledge to become fluent in the PRIZ ecosystem.
Our unique approach to training is combining theoretical knowledge with practical experience on real projects.
We train engineers with the most in-demand engineering qualification - problem-solving and engineering thinking.
Our goal is to train a team of engineers who will emerge as leaders in problem-solving within the organization.
The key to solving complex problems is to break them down into smaller, more manageable pieces.
Our approach to training and education is focused on providing applied knowledge. We prioritize practicing systematic problem-solving, so engineers can apply it immediately in their day-to-day work.
Contact SalesTeams that are confident enough to start working with the PRIZ Platform are welcome to use any of the resources we have made available. However, we are always available to provide support and assistance.
Get StaredThe most effective approach is when an expert facilitates the process of problem solving projects. It combines practical learning with solving a problem that delivers a direct value to an organization.
Contact SalesWet cleaning is widely used in microchip manufacturing. Single wafer equipment is working as follows. A wafer rotates, and chemistry is poured from a movable nozzle. Water rinsing is performed at the end of the process. Loading of a new batch of the chemistry resulted in excursion - a strongly increased amount of defects was observed on the wafer after the processing. The project is dedicated to the failure analysis and creation of innovative solutions.
The process is related to microelectronics - microchip manufacturing. The purpose of the process is to create a SiO2 layer on the surface of a Si wafer. Equipment: Vertical furnace to heat the wafers in the Q2 atmosphere and perform oxidation on the wafer surface. Process: The oxidation occurs on the front side and on the back side of the wafer Requirements: Create a SiO2 thin layer with a certain thickness and low sigma - low standard deviation of the thickness between the wafers and within the wafer Failure: Wafers from the lower zone have higher thickness and significantly higher within wafer sigma (standard deviation of the thickness within the wafer)
Flash heating of a wafer is widely used in microchip manufacturing. The purpose of the process is to prevent the diffusion of ions and atoms. During the flash process, a wafer breakage occurs. The project's purpose is to learn and understand the mechanism of the wafer breakage and propose the solutions to prevent the wafer breakage
The number of particles is a critical parameter for microchip manufacturing. Each, even a very small particle, can potentially destroy a die. Therefore filters are widely used. Water is always filtered through fine filters to reduce the number of particles. Nevertheless, if the filter is too fine, it could cause a problem. This issue was investigated with the help of Functional Modeling. Possible solutions were generated using 40 Inventive Principles.
We offer a variety of courses to help you learn how to use our app to solve problems. Our courses are designed for users of all skill levels, from beginners to experienced users. Our courses include video lessons, hands-on exercises, and support from experienced instructors.