PRIZ unlocks your team’s inventive muscle, turning stubborn engineering challenges into celebrated breakthroughs with systematic problem-solving tools and methods that deliver smarter, repeatable, innovative solutions.
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PRIZ Guru provides a state-of-the-art machine-assisted innovation platform that streamlines problem-solving and helps to uncover hidden business opportunities. With a comprehensive ecosystem of tools and processes, PRIZ supports and enhances engineering thinking while promoting seamless communication among all stakeholders.
Our platform offers a range of creative thinking tools that help you think outside the box and develop new, innovative solutions.
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AI-Assisted Facilitation will guide you through a structured process to increase your efficiency in engineering thinking and continuous improvement, while promoting consistent learning within an organization.
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Our platform offers a seamless integration between project management and your problem-solving process.
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Our platform promotes open communication, shared goals, conflict resolution, collective ownership, trust, and positive relationships among all stakeholders.
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Engineers no longer have to do the most boring part of problem-solving - writing a report for stakeholders - as the report is automatically generated for them.
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The ultimate goal of every project is to generate innovative ideas and solutions. PRIZ Platform's idea management provides full transparency of all ideas and decisions made throughout a project.
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Our experts will guide you through every step, helping you master the PRIZ ecosystem, its functionalities, and problem-solving techniques. With tailored training, you'll be well-prepared to tackle any challenge that comes your way.
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Our training provides engineers with the necessary skills and knowledge to become fluent in the PRIZ ecosystem.
Our unique approach to training is combining theoretical knowledge with practical experience on real projects.
We train engineers with the most in-demand engineering qualification - problem-solving and engineering thinking.
Our goal is to train a team of engineers who will emerge as leaders in problem-solving within the organization.
The key to solving complex problems is to break them down into smaller, more manageable pieces.
Our approach to training and education is focused on providing applied knowledge. We prioritize practicing systematic problem-solving, so engineers can apply it immediately in their day-to-day work.
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Teams that are confident enough to start working with the PRIZ Platform are welcome to use any of the resources we have made available. However, we are always available to provide support and assistance.
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The most effective approach is when an expert facilitates the process of problem solving projects. It combines practical learning with solving a problem that delivers a direct value to an organization.
Contact SalesThe process is related to microelectronics - microchip manufacturing.The purpose of the process is to create a SiO2 layer on the surface of a Si wafer. Equipment: Vertical furnace to heat the wafers in the Q2 atmosphere and perform oxidation on the wafer surface. Process: The oxidation occurs on the front side and on the back side of the wafer Requirements: Create a SiO2 thin layer with a certain thickness and low sigma - low standard deviation of the thickness between the wafers and within the waferFailure: Wafers from the lower zone have higher thickness and significantly higher within wafer sigma (standard deviation of the thickness within the wafer)
This project showcases how functional modeling can drive innovation by analyzing and simulating various versions of a vacuum cleaner. By studying the functional model, you will experience firsthand how the Functional Modeling creative thinking tool helps identify opportunities for improvement and generate innovative ideas for the next generation of products.Through this example, you’ll learn how to dissect the functionality of a vacuum cleaner, revealing ways to enhance its performance, efficiency, and user experience—ultimately paving the way for future innovations.
To address the requirement for smaller and more powerful processors, innovative 3D packaging is developed, which involves stacking many layers vertically. This enhances performance but produces mechanical difficulties such as wafer bowing as a result of internal tension caused by thermal expansion mismatch. this problem has approached from a materials engineering perspective, investigating how material selection, layer thickness, and deposition conditions may minimize stress and prevent deformation.
Wet cleaning is widely used in microchip manufacturing. Single wafer equipment is working as follows. A wafer rotates, and chemistry is poured from a movable nozzle. Water rinsing is performed at the end of the process. Loading of a new batch of the chemistry resulted in excursion - a strongly increased amount of defects was observed on the wafer after the processing. The project is dedicated to the failure analysis and creation of innovative solutions.
We offer a variety of courses to help you learn how to use our app to solve problems. Our courses are designed for users of all skill levels, from beginners to experienced users. Our courses include video lessons, hands-on exercises, and support from experienced instructors.
