Get Started Free

Regain control over yield excursions, recurring defects, and change risk.

Accelerate detect → contain → failure mechanism → preventive fix, with disciplined change control that reduces recurrence and protects yield stability.

VP Engineering photo
PRIZ gave our team a structured way to move from firefighting to real root-cause thinking. It helped us align faster and turn investigations into reusable learning.
VP Engineering · Semiconductor manufacturer
Faster alignment Less firefighting Reusable knowledge

TRUSTED BY TOP COMPANIES

company logo
company logo
company logo
company logo
company logo
company logo
company logo
company logo
company logo
company logo
company logo
company logo
company logo
company logo
company logo
company logo
company logo
company logo
company logo
company logo
company logo
company logo
company logo
company logo
company logo
company logo
company logo
company logo
company logo
company logo

Turn engineering pain into your repeatable wins

PRIZ Guru gives you a guided, no-guesswork workflow for root cause analysis, process improvement, and systematic innovation, so you spend less time firefighting and more shipping reliable, profitable outcomes.

Incidents Chronic problems High cost Low yield Culture of systematic innovation

Faster containment. Stronger fixes. Fewer repeats.

  • Move from chaos to clarity fast
  • Get to root cause with evidence
  • Prevent recurrence by default
Request a Demo
Process Engineering Lead • Semiconductor manufacturer
PRIZ helped us stop jumping to fixes and first understand what was really happening.
Process Engineering Lead · Semiconductors
image

Make “unsolvable” problems solvable again.

  • Expose why the problem persists
  • Reveal what blocks solutions
  • Turn every solved issue into a reusable asset
Request a Demo
Continuous Improvement Manager • Advanced manufacturing
The value was not just solving one issue. It was finally seeing why the problem kept coming back.
Continuous Improvement Manager · Advanced manufacturing
image

See where the money goes. Then control it.

  • Trace cost back to process mechanisms
  • Reduce cost without sacrificing performance
  • Make cost reduction part of your operating system
Request a Demo
Operations Director • Semiconductor manufacturer
The discussion shifted from opinions to mechanisms, actions, and measurable business impact.
Operations Director · Semiconductor manufacturer
image

Diagnose yield loss mechanisms. Improve yield predictably.

  • Identify the mechanism behind yield loss
  • Run better experiments
  • Build a yield-improvement habit
Request a Demo
Yield Engineering Manager • Fab
PRIZ gave the team a disciplined way to connect symptoms, process conditions, and root-cause hypotheses.
Yield Engineering Manager · Fab
image

One language. Less politics. More compounding learning.

  • A shared engineering language
  • Collaboration that complements
  • From “event-driven improvement” to a predictable pulse
Request a Demo
Engineering Excellence Lead • Global manufacturing
It gave engineers a shared language. The meetings became clearer, faster, and less political.
Engineering Excellence Lead · Manufacturing
image

Elevate problem-solving with tools and methods

PRIZ Guru is a methodology-first innovation platform that systematizes problem solving and helps teams generate the innovative solutions companies need to stay competitive and profitable. With a unified toolkit of structured methods and processes, PRIZ strengthens engineering thinking and promoting seamless communication among all stakeholders.

Creative thinking tools Guided Facilitation (AI Optional) Project management Collaboration Automatic reporting Idea management

Creative thinking tools

Our platform offers a range of creative thinking tools that help you think outside the box and develop new, innovative solutions.

Learn more
feature image

Guided Facilitation (AI Optional)

Guided facilitation walks teams through a structured, repeatable process that strengthens engineering thinking, drives continuous improvement, and embeds consistent learning across the organization. Works fully without AI; an optional assistant can speed feedback, research, and reporting.

Learn more
feature image

Project management

Our platform offers a seamless integration between project management and your problem-solving process.

Learn more
feature image

Collaboration

Our platform promotes open communication, shared goals, conflict resolution, collective ownership, trust, and positive relationships among all stakeholders.

Learn more
feature image

Automatic reporting

Engineers no longer have to do the most boring part of problem-solving - writing a report for stakeholders - as the report is automatically generated for them.

Learn more
feature image

Idea management

The ultimate goal of every project is to generate innovative ideas and solutions. PRIZ Platform's idea management provides full transparency of all ideas and decisions made throughout a project.

Learn more
feature image

Showcasing Successful Projects

Microelectronics

Wafer cleaning issues at the wet process

Wet cleaning is widely used in microchip manufacturing. Single wafer equipment is working as follows. A wafer rotates, and chemistry is poured from a movable nozzle. Water rinsing is performed at the end of the process. Loading of a new batch of the chemistry resulted in excursion - a strongly increased amount of defects was observed on the wafer after the processing. The project is dedicated to the failure analysis and creation of innovative solutions.

user avatar
Dr. Anatoly Agulyansky
Microelectronics

SiO2 thin film creation in Diffusion furnace - Process Functional Modeling

The process is related to microelectronics - microchip manufacturing. The purpose of the process is to create a SiO2 layer on the surface of a Si wafer. Equipment: Vertical furnace to heat the wafers in the Q2 atmosphere and perform oxidation on the wafer surface. Process: The oxidation occurs on the front side and on the back side of the wafer Requirements: Create a SiO2 thin layer with a certain thickness and low sigma - low standard deviation of the thickness between the wafers and within the wafer Failure: Wafers from the lower zone have higher thickness and significantly higher within wafer sigma (standard deviation of the thickness within the wafer)

user avatar
Dr. Anatoly Agulyansky
Microelectronics

Wafer breakage at flash heating

Flash heating of a wafer is widely used in microchip manufacturing. The purpose of the process is to prevent the diffusion of ions and atoms. During the flash process, a wafer breakage occurs. The project's purpose is to learn and understand the mechanism of the wafer breakage and propose the solutions to prevent the wafer breakage

user avatar
Dr. Anatoly Agulyansky
Mechanics

Functional Modeling of a Vacuum Cleaner: A Pathway to Innovation

This project showcases how functional modeling can drive innovation by analyzing and simulating various versions of a vacuum cleaner. By studying the functional model, you will experience firsthand how the Functional Modeling creative thinking tool helps identify opportunities for improvement and generate innovative ideas for the next generation of products. Through this example, you’ll learn how to dissect the functionality of a vacuum cleaner, revealing ways to enhance its performance, efficiency, and user experience—ultimately paving the way for future innovations.

user avatar
Dr. Anatoly Agulyansky

Our courses

We offer a variety of courses to help you learn how to use our app to solve problems. Our courses are designed for users of all skill levels, from beginners to experienced users. Our courses include video lessons, hands-on exercises, and support from experienced instructors.